Select High Volume Mnfg. Site
Select Critical Mnfg. Processes: For “Same As” Assy. Process
• Surface Mount Technology
• Ball Grid Array
• Thin Ball Grid Array
• Direct Chip Attach
• Flip Chip, wire bond
• Chip - to - Chip Bond
• System in a single package
• PCB’s, flexible tape, ceramics
• Overmold System Requirements
• Marking Requirements
Perform Process Gap Analysis
Identify VLSIP Equipment Set
Outline White Paper Process DOE’s
Document Mnfg Data Pack Content (Product Quality Plan) |
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Set Product Specifications
Define Q.A. S.P.C. Parameters
DOE’s Input to Mnfg. Data Pack Equipment Configuration Input
NRE Tooling/ Programming Input
Tool Design/Drawings Input
Resolve Proprietary Issues
Materials Preparation Input
Assembly Traveler Input
Set Production Schedule
Set M.D.P. Review Schedule
- - - - - -----(with Customer)
Schedule 1st Article Review
- - - - - -----(with Customer)
Set Cont. Process Imp. Plan
- - - - - -----(with Customer) |
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Manufacturing Data Pack - (review with Customer)
Incremental Asby. Samples - (define with Customer)
VLSIP Drawings pack
Process Enging Access - (By Customer or H-VM)
Validate H-VM 1st Article
H-VM Consultation |
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