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SEMICONDUCTOR BACK END

 

We routinely combine conventional Surface Mount printed circuit board assembly technologies with state-of-the-art Ball Grid Array, Flip Chip, Stacked Chip, Chip Scale, and Direct Chip semiconductor assembly technologies. We support, as a leading edge technology company, engineering, prototype, low and higher volume assembly.

Dicing:
VLSIP receives and dices silicon slices in wafer format after probe, with diameters up to and including 12”.

Packaging Technology:

Connections

Packages

Comments

Out side




Leads




Balls




Bumps

Inside




Wire




Bond




Bumps

*     SOT23/SO/……./TSSOP

*     TQFP

*     PowerPad (L/T/V QFP)

*     PowerPad (TQFP, VQFP)

*     Enhanced BGA
(Semi-Rigid, Heat Sink)

*     Multi chip, Rigid Substrate
(Ceramic, Metal)
Semi-Rigid Substrates (PCB)
Tape Based

*     Chip Scale, Semi-Rigid Substrates
 Tape (10-19mm, 1.0mm thick)
Tape (4.5-19mm, 0.8mm thick)

*     Quad Flat No Lead (3-8mm)

*     Flip Chip, Rigid Substrates
Semi-Rigid Substrates
 Tape Based

48-208 pins
32-208 pin
Up to 207 pin
256-1028 pin

Embedded Components
System in Package
 
Up to 255 pin
300+ pins
Up to 168 pins – 300+pins
14-56 pins


Scheduling of Quick Turn Assembly (Request a Quote):
VLSIP Technologies will provide a firm commitment to a requested turn time and ship date after receiving your completed work request.

 

 

 

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