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Design & Layout
Function Convergence
Miniaturization
Interconnection Technologies
Semiconductor Back End
Material Procurement
Prototype Assembly
Volume Production
Testing
MARKETS SERVED
Medical
Communications, Wireless, Networking
Emerging Businesses
Commercial, Industrial & Military
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SEMICONDUCTOR BACK END
 
We routinely combine conventional Surface Mount printed circuit board assembly technologies with state-of-the-art Ball Grid Array, Flip Chip, Stacked Chip, Chip Scale, and Direct Chip semiconductor assembly technologies. We support, as a leading edge technology company, engineering, prototype, low and higher volume assembly.

Dicing:
VLSIP receives and dices silicon slices in wafer format after probe, with diameters up to and including 12”.

Packaging Technology:
Connections Packages Comments
Out side




Leads




Balls




Bumps
Inside




Wire




Bond




Bumps
  • SOT23/SO/……./TSSOP
  • TQFP
  • PowerPad (L/T/V QFP)
  • PowerPad (TQFP, VQFP)
  • Enhanced BGA
    (Semi-Rigid, Heat Sink)
  • Multi chip, Rigid Substrate
    (Ceramic, Metal)
    Semi-Rigid Substrates (PCB)
    Tape Based
  • Chip Scale, Semi-Rigid Substrates
     Tape (10-19mm, 1.0mm thick)
    Tape (4.5-19mm, 0.8mm thick)
  • Quad Flat No Lead (3-8mm)
  • Flip Chip, Rigid Substrates
    Semi-Rigid Substrates
     Tape Based
48-208 pins
32-208 pin
Up to 207 pin
256-1028 pin

Embedded Components
System in Package
 
Up to 255 pin
300+ pins
Up to 168 pins – 300+pins
14-56 pins

Scheduling of Quick Turn Assembly (Request a Quote):
VLSIP Technologies will provide a firm commitment to a requested turn time and ship date after receiving your completed work request.
 
 
 
Copyright 2007 VLSIP Technologies, Inc | All Rights Reserved.