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| SEMICONDUCTOR BACK END |
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We routinely combine conventional Surface Mount printed circuit board assembly technologies with state-of-the-art Ball Grid Array, Flip Chip, Stacked Chip, Chip Scale, and Direct Chip semiconductor assembly technologies. We support, as a leading edge technology company, engineering, prototype, low and higher volume assembly.
Dicing:
VLSIP receives and dices silicon slices in wafer format after probe, with diameters up to and including 12”.
Packaging Technology:
| Connections |
Packages |
Comments |
Out
side
Leads
Balls
Bumps |
Inside
Wire
Bond
Bumps |
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- SOT23/SO/……./TSSOP
- TQFP
- PowerPad (L/T/V QFP)
- PowerPad (TQFP, VQFP)
- Enhanced BGA
(Semi-Rigid, Heat Sink)
- Multi chip, Rigid Substrate
(Ceramic, Metal)
Semi-Rigid Substrates (PCB)
Tape Based
- Chip Scale, Semi-Rigid Substrates
Tape (10-19mm, 1.0mm thick)
Tape (4.5-19mm, 0.8mm thick)
- Quad Flat No Lead (3-8mm)
- Flip Chip, Rigid Substrates
Semi-Rigid Substrates
Tape Based
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48-208 pins
32-208 pin
Up to 207 pin
256-1028 pin
Embedded Components
System in Package
Up to 255 pin
300+ pins
Up to 168 pins –
300+pins
14-56 pins |
Scheduling of Quick Turn Assembly (Request a Quote):
VLSIP Technologies will provide a firm commitment to a requested turn time and ship date after receiving your completed work request. |
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