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PROTOTYPE ASSEMBLY
 
VLSIP Materials and Process Range for Prototypes & Modules:
  • Substrates/packages: Thin and Thick film LTCC (Ceramic), M.A.P. Laminate (FR-4, BT, Rogers), Flex-Tape (50 - 75uM thick), Alumina Tubs
  • Wafer Processes: Saw and Die Pick of wafers up to 300mm (12in) in size.
  • Die Processes: Wire-bondable, Flip-Chip, Die-to-Die bonding, Stacked-Die.
  • Wire Bonding: Ball or Wedge bonding, 0.7mil - 10mil wires, 45uM stagger or serial fine pad pitch, die pad openings as small as 45uM.
  • Flip-Chip Die: to 2200 bump I/O’s, .2mm Bump Pitch.
  • SMT attach: High-speed placement to 10uM accuracy,  0201 feeders.
  • Encapsulation: Overmold systems with FAME assist, Liquid Encapsulation
  • Ball Attach Capability: Ceramic or laminate, 0.5mm pad pitch (0.25mm balls)
  • Singulation: Laminate, Ceramic singulation saw machines; Flex-tape presses.
  • Marking: Laser-etched plate epoxy transfer marking systems.
 
 
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