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VLSIP
Materials and Process Range for Prototypes & Modules:
Substrates/packages:
Thin and Thick film LTCC (Ceramic), M.A.P. Laminate (FR-4, BT, Rogers),
Flex-Tape (50 - 75uM thick), Alumina Tubs
Wafer
Processes: Saw and Die Pick of wafers up to 300mm (12in) in size.
Die
Processes: Wire-bondable, Flip-Chip, Die-to-Die bonding, Stacked-Die.
Wire
Bonding: Ball or Wedge bonding, 0.7mil - 10mil wires, 45uM stagger or
serial fine pad pitch, die pad openings as small as 45uM.
Flip-Chip
Die: to 2200 bump I/O’s, .2mm Bump Pitch.
SMT
attach: High-speed placement to 10uM accuracy, 0201 feeders.
Encapsulation:
Overmold systems with FAME assist, Liquid Encapsulation
Ball
Attach Capability: Ceramic or laminate, 0.5mm pad pitch (0.25mm balls)
Singulation:
Laminate, Ceramic singulation saw machines; Flex-tape presses.
Marking: Laser-etched plate
epoxy transfer marking systems.
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