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VLSIP has the interconnect technologies required for
today’s products and tomorrow’s designs.
VLSIP’s Interconnect
Technology Roadmap, driven by power (lower), size (smaller) and
performance (better) has kept pace with and continues to track advances
in semiconductor and microchip complexity.
Increased chip complexity is enabling convergence not only of several
devices in one, but of more functions into the same or similar device
creating new products and new markets. VLSIP is there with the
interconnect technologies required to support both, and the 3D modeling
and simulation to comprehend the impact of parasitics to module design
and performance prior to fabrication.
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