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| INTERCONNECTION TECHNOLOGIES |
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Leading Edge Strategy (Interconnection)
- chip to chip and chip to chip to package
- chip to multilayer printed circuit boards directly
- chips embedded into modules
- chip to package and to substrates including
flexible substrates with external I/Os.
- Surface Mount Technology ( 0101 packaged parts)
- Ball Grid Array (.25mm ball size, .4mm pitch and ball counts from 4 to 1152)
- chip to package with external I/Os
- Flip Chip (3 mil ball size, 8 mil pitch)
- Stacked Chip, Chip Scale, and Direct Chip Attach
- Mixed technology substrates, tapes, rigid flex
and flex as well as rigid printed circuit boards.
Subsystem Microchip Modules for Military, Space & Homeland Security. Industrial & Communication Applications |
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