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Leading Edge Strategy (Interconnection)
chip
to chip and chip to chip to package
chip
to multilayer printed circuit boards directly
chips
embedded into modules
chip
to package and to substrates including flexible substrates with
external I/Os.
Surface
Mount Technology ( 0101 packaged parts)
Ball
Grid Array (.25mm ball size, .4mm pitch and ball counts from 4 to
1152)
chip
to package with external I/Os
Flip
Chip (3 mil ball size, 8 mil pitch)
Stacked
Chip, Chip Scale, and Direct Chip Attach
Mixed
technology substrates, tapes, rigid flex and flex
as well as rigid printed circuit boards.
Subsystem Microchip Modules
for Military, Space & Homeland Security. Industrial &
Communication Applications
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