VLSIP's Core Competencies Create Manufacturing Solutions
OUR SERVICES
Design & Layout
Function Convergence
Miniaturization
Interconnection Technologies
Semiconductor Back End
Material Procurement
Prototype Assembly
Volume Production
Testing
MARKETS SERVED
Medical
Communications, Wireless, Networking
Emerging Businesses
Commercial, Industrial & Military
PARTNER LINKS
Customer Login
 
INTERCONNECTION TECHNOLOGIES
 
Leading Edge Strategy  (Interconnection)

  • chip to chip and chip to chip to package
  • chip to multilayer printed circuit boards directly
  • chips embedded into modules
  • chip to package and to substrates including flexible substrates with external I/Os.
  • Surface Mount Technology  ( 0101 packaged  parts)
  • Ball Grid Array (.25mm ball size, .4mm pitch and ball counts from 4 to 1152)
  • chip to package with external I/Os
  •  Flip Chip (3 mil ball size, 8 mil pitch)
  • Stacked Chip, Chip Scale, and Direct Chip Attach
  • Mixed technology substrates, tapes,  rigid flex and flex as well as rigid printed circuit boards.

Subsystem Microchip Modules for Military, Space & Homeland Security. Industrial & Communication Applications
 
 
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