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Emerging businesses find
a strategic
advantage when out-sourcing with VLSIP Technologies.
Services are customized to meet time-to-market challenges and reduce
total cost of ownership.
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Product
design and redesign concepts can be pursued and implemented with
minimal cost.
o
Component
selections are optimized by VLSIP quality-to-cost design focus for best
materials-to-process compatibility.
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Materials
Authorized Vendor List management by VLSIP can minimize start-up costs.
o
Issues
are effectively resolved with VLSIP manufacturing core competencies.
o
Capital
equipment investment and risk can be minimized.
o
Quality/Reliability
Plan data collection is reviewed by VLSIP for agreement on Pareto and
cost-reduction focus items.
o
Engineering
support requirements are met by VLSIP’s experienced staff.
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Stacked Die Wire Bond
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Chip to Chip Wire Bond
Interconnection
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Emerging Businesses are
fully supported with technical competence and with responsive
communications.
VLSIP’s
Technology Roadmap is driven by chip complexity, substrate interface,
evolving industry technologies and interconnection manufacturing.
VLSIP
is continues to invest in state-of-the-art manufacturing equipment and
processes, to provide system designers the manufacturing infrastructure
to support new designs and products.
VLSIP
is committed to work closely with the Customer Product Team to meet
customer requirements, including time-to-market and target costs.
VLSIP
protects proprietary information by maintaining confidentiality
of products, processes and technology, including, as required,
restricted access to production areas & documentation. VLSIP has
never had a violation since inception.
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