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| EMERGING BUSINESSES |
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Emerging businesses find a strategic advantage when out-sourcing with VLSIP Technologies.
Services are customized to meet time-to-market challenges and reduce total cost of ownership.
- Product design and redesign concepts can be pursued and implemented with minimal cost.
- Component selections are optimized by VLSIP quality-to-cost design focus for best materials-to-process compatibility.
- Materials Authorized Vendor List management by VLSIP can minimize start-up costs.
- Issues are effectively resolved with VLSIP manufacturing core competencies.
- Capital equipment investment and risk can be minimized.
- Quality/Reliability Plan data collection is reviewed by VLSIP for agreement on Pareto and cost-reduction focus items.
- Engineering support requirements are met by VLSIP’s experienced staff.
Stacked Die Wire Bond |
Chip to Chip Wire Bond Interconnection |
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Emerging Businesses are fully supported with technical competence and with responsive communications.
- VLSIP’s Technology Roadmap is driven by chip complexity, substrate interface, evolving industry technologies and interconnection manufacturing.
- VLSIP is continues to invest in state-of-the-art manufacturing equipment and processes, to provide system designers the manufacturing infrastructure to support new designs and products.
- VLSIP is committed to work closely with the Customer Product Team to meet customer requirements, including time-to-market and target costs.
- VLSIP protects proprietary information by maintaining confidentiality of products, processes and technology, including, as required, restricted access to production areas & documentation. VLSIP has never had a violation since inception.
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