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And Reliability
OUR SERVICES
Design & Layout
Function Convergence
Miniaturization
Interconnection Technologies
Semiconductor Back End
Material Procurement
Prototype Assembly
Volume Production
Testing
MARKETS SERVED
Medical
Communications, Wireless, Networking
Emerging Businesses
Commercial, Industrial & Military
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COMMUNICATIONS, WIRELESS, NETWORKING
 
VLSIP is a leading supplier of semiconductor / electronic modules for wireless, wire line, microwave, and fiber optic communications applications for engineering prototype as well as low and higher volume assembly.
Advanced design with
11 unpackaged silicon & GaAs chips on board plus more than a dozen additional packaged components.
VLSIP’s integrated, design, layout, engineering and manufacturing processes combine state-of-the-art semiconductor packaging and process control techniques and leading edge wirebond assembly technology with conventional surface mount board assembly technologies. We assemble both packaged and unpackaged microchips into modules mounted on rigid or flex substrates, and deliver the complex high reliability integrated solutions demanded by our customer’s.
200 MHz device with 12 layers, 6 unpackaged silicon & GaAs chips on board plus dozens of packaged components
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