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OUR SERVICES
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MARKETS
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PARTNER
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COMMUNICATIONS, WIRELESS, NETWORKING
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VLSIP is a leading supplier of mixed signal
semiconductor / electronic modules for wireless, wire line, microwave,
and fiber optic communications applications for engineering prototype
as well as low and higher volume assembly.
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Advanced design with
11 unpackaged silicon & GaAs chips on board plus more than a
dozen additional packaged components.
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VLSIP’s integrated, design, layout, engineering and
manufacturing processes combine state-of-the-art semiconductor (mixed
signal, including RF) packaging and process control techniques and
leading edge wire bond assembly technology with conventional surface
mount board assembly technologies. We assemble both packaged and
unpackaged microchips into modules mounted on rigid or flex substrates,
and deliver the complex high reliability integrated solutions demanded
by our customer’s.
3D EM Modeling and Simulation to comprehend impact
of parasitic to module design and performance prior to fabrication.
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200 MHz device with 12
layers, 6 unpackaged silicon & GaAs chips on board plus dozens
of packaged components
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